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Three-axis end face grinding machine
By setting three types of diamond grinding wheels (polishing sheets) optimized for each process, the workpiece end face can then be processed to a mirror finish in a short time with automatic operation.
Mipox WaferEdgePolisher boasts a track record of over 200 units delivered, primarily to SI wafer manufacturers and reclaimed wafer manufacturers.
Benefits of Tape Edge Polisher - Minimal damage to the wafer - Removal of films (e.g., SiO2) on the wafer edge is possible - Chemical-free processing - Easy utility connection - Capable of shaping various edge geometries - Both rough grinding and fine polishing are possible - Top edge polishing is possible - Can polish difficult materials such as SiC and GaN - Compatible with notches and orifices
Simple is best! Compact type end face polishing machine.
Heso-tori-kun is a compact edge polishing machine that seems like it should exist but doesn't. It is ideal for removing "navel" areas near corners, as well as "joint marks" and "overlap seams," which are difficult to address with conventional disc grinders or belt sanders. Heso-tori-kun excels particularly in processing small quantities of 1 to 5 workpieces. Thanks to its uniquely developed table function, it can also handle tapered edges of thick plate products, demonstrating stable navel removal performance. 【Features】 ○ Ideal for small quantity workpieces ○ Easy removal of navels on product peripheries ○ Compact and lightweight for easy portability ○ Safe and secure operation with both hands, reducing fatigue ○ Capable of accommodating laser beam tilt For more details, please contact us or download the catalog.
